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HLMC and Cypress Announce Initial Production of Smart Card ICs Using 55nm Low-Power Process Technology with SONOS Embedded Flash

Release time:2017-10-27

 

Cost-Effective SONOS Embedded Nonvolatile Memory Delivers High-Yield,
Scalable Process
 
SHANGHAI, China, October 25, 2017– Shanghai Huali Microelectronics Corporation (HLMC), one of the most advanced pure play wafer foundries in China, and Cypress Semiconductor Corp. (NASDAQ: CY), a leading provider of embedded nonvolatile memory solutions, today announced the start of production of smart card ICs for lead customers using HLMC’s 55nm low power (LP) process technology (1.2V core , 5V IO) with Cypress' SONOS (Silicon Oxide Nitride Oxide Silicon) embedded Flash memory intellectual property (IP). The embedded Flash memory is optimized for smart card and bank card ICs and delivers low wafer and die costs with unmatched scalability. The technology and design IP will be available for full production by HLMC customers in the fourth quarter of 2017.
 
HLMC licensed Cypress' SONOS embedded nonvolatile memory (eNVM) IP in 2014, developed the 55nm LP embedded Flash process and now provides special IP blocks (including 32-bit Flash macro, 8KV ESD 5V IO and Analog) and chip probe service for smart cards. This technology provides lower manufacturing costs, with only 3 masks added compared to more than 10 additional masks for other eNVM technologies. SONOS delivers intrinsically high yields and best-in-class reliability, 20 years of data retention, 500,000 program/erase endurance cycles, and robust resistance to soft errors.  
 
"With the rapid growth of smart cards and bank cards, we are excited to reach this milestone and look forward to a fast production ramp to meet our customers’ demand,” said Jack Qi Shu, Vice President at HLMC. "Cypress’ SONOS is a cost-effective embedded nonvolatile memory that delivers proven high yields. Its reliability and efficiency are ideal to enable high-volume production for smart cards ICs."
 
“The combination of HLMC’s robust 55nm LP process technology and manufacturing expertise along with the high-performance and leading reliability of our SONOS Flash memory enabled a smooth path to achieve risk production of these smart card ICs,” said Kevin Donnelly, Vice President of the Intellectual Property Business Unit at Cypress. “Our collaboration with HLMC is another example of how Cypress is working with the world’s leading foundries to establish SONOS as the industry's top choice for an embedded nonvolatile memory platform.”
 
About Shanghai Huali Microelectronics
Founded in 2010, Shanghai Huali Microelectronics Corporation ("HLMC") is a leading 300mm pure-play wafer foundry in China. HLMC owns a 300mm fab with the capacity of 35K wafers per month and is constructing the second 300mm fab with the capacity of 40K wafers per month. HLMC offers a broad selection of technologies across 55nm to 28nm and focuses on differentiated process technologies such as RF, HV, eFlash, ULP, NOR flash and CMOS Image Sensor for a wide range of applications. HLMC is devoted to providing customers with advanced process technologies and comprehensive foundry services. Learn more about HLMC online at www.kobecity.biz.
 
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About Cypress
Cypress is the leader in advanced embedded system solutions for the world’s most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress’ programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com.
 
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