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HLMC Participated in SEMICON China 2016

Release time:2016-03-16

 

(Shanghai, China- 16th March, 2016) Shanghai Hua Li Microelectronics Corporation (“HLMC”), a China leading pure-play 300mm wafer foundry, showcased a variety of advanced and specialty process technologies and solutions at Booth 5401 in Hall N5 during the SEMICON 2016 held from March 15 to 17.

On the 15th March, 2016, Ms. Qu Weizhi, Counselor of State Council, President of the China Electronic Chamber of Commerce, and Mr. Chen Mingbo, Chairman of Shanghai Municipal Commission of Economy and Information Technology, chose HLMC’s booth as the first visiting site. The guests were warmly welcomed by Mr. Jack Qi Shu , Vice President of HLMC, and were introduced the latest technology development in 28nm logic process and 55/40nm specialty process.

On the 16th March, 2016, Mr. Shu was invited to make a keynote speech at “Build China IC Manufacturing Chain Forum”, discussing with the audiences about how to develop and upgrade China IC industry under “Made in China 2025” and “Supply-Side reforms” .

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