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· Shanghai Huali Microelectronics Corporation (HLMC) Announces Collaboration with Adesto and CNE around RRAM Technology for RFID, Stand Alone NVM and Microcontroller Applications 2018-06-04
· HLMC Starts Equipment Move-in at the New 300mm Wafer Production Line 2018-05-21
· HLMC and Cypress Announce Initial Production of Smart Card ICs Using 55nm Low-Power Process Technology with SONOS Embedded Flash 2017-10-27
· HLMC, Cypress Announced the Production of Embedded Flash Products Using 55nm Low Power Process Technology with SONOS 2017-03-29
· HLMC attended the 53rd DAC in Austin, US 2016-06-22
· HLMC Participated in SEMICON China 2016 2016-03-16
· HLMC Participated in ICCAD 2015 2015-12-17
· HLMC and MediaTek Started Tape- out in 28nm Mobile Chip Successfully 2015-11-12
· HLMC Attended CeBIT 2015 in Hannover, Germany 2015-03-18
· HLMC Develops Specialty Technology in Pursuit of Growing IoT Market 2014-12-31
· HLMC and MediaTek Cooperate on 28nm Technology Development 2014-12-15
· Cypress and HLMC Demonstrate Working Silicon Cells Leveraging 55-Nanometer Embedded Flash IP 2014-08-25
· Shanghai Huali Microelectronics Corporation Participated in SEMICON China 2014 2014-04-04
· HLMC Develops 55nm Reference Flow Based on Cadence Encounter Digital Technology 2013-08-15
· Shanghai Huali Microelectronics Corporation Participated in SEMICON China 2013 2013-04-03
· HLMC Attended the “2013 Cross-strait (Shanghai) IC Industrial Cooperation and Development Forum” 2013-04-03
· Shanghai Huali Microelectronics Corporation Participated in ICCAD 2012 2012-12-13
· HLMC Passed ISO27001:2005 Information Security Management System Certification 2012-07-06
· HLMC Attended the “2012 Cross-strait (Taipei) IC Industrial Cooperation and Development Forum” 2012-04-25
· Yu Zhengsheng Visited HLMC Booth at Semicon China 2012 2012-03-26

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